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Cellular IoT Module and Chipset Market Tracker and Forecast (Q3 2025)

Quarterly Database: Global Shipments, Revenue & ASP (2018โ€“2029)

Key Data Snapshot:

  • Q3 2025 Revenue Growth: +10% YoY
  • Top 5 Market Share: 74% (Quectel, China Mobile, Fibocom, SIMCom, Telit)
  • Fastest Growing Technology: LTE Cat 1 bis (+49% YoY)
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Document type: XLSX, WEBAPP
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Published: December 2025
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Main author: Satyajit Sinha
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  • 40 cellular IoT module brands
  • 13 cellular IoT chipset companies
  • 10 regions
  • 10 technology splits
  • 16 industry verticals
  • 150 unique model-level chipsets
  • 737 unique model-level modules

โ†’Full product details

Global Cellular IoT Module and Chipset Market Size & Growth (Q3 2025)

The global cellular IoT module and chipset market revenue increased 10% YoY in Q3 2025. This growth extends the recovery momentum established earlier in the year and marks the fifth consecutive quarter of shipment growth following the resolution of inventory overhangs in 2024. The data indicates sustained demand for both connectivity chipsets and integrated modules as supply chains stabilize.

Key Market Findings

  • Technology Segmentation (LTE Cat 1 bis): LTE Cat 1 bis shipments grew 49% YoY in Q3 2025. This continues the high-growth trend observed in Q1 2025 where shipments surged 122% YoY as the technology displaces 2G and 3G legacy networks for mid-speed IoT applications.
  • Competitive Landscape & Consolidation: The market exhibits high concentration with the top five vendors (Quectel, China Mobile, Fibocom, SIMCom, Telit) accounting for 74% of the combined market share in Q3 2025. This consolidation persists following the exit of u-blox from the cellular module sector on June 6, 2025, when Trasna acquired the company’s cellular business.
  • Geopolitical Impact: Vendor selection strategies reflect ongoing geopolitical shifts. The US Department of Defense added Quectel to the 1260H list on January 6, 2025. This designation prompted Western device manufacturers to initiate dual-sourcing discussions and evaluate risk mitigation strategies throughout 2025.
  • Regulatory Compliance: The EU Radio Equipment Directive (RED) introduced mandatory cybersecurity requirements for radio equipment in the European Economic Area effective August 1, 2025. This regulation necessitates firmware updates across the installed base and influences module selection for European deployments.
  • Future Outlook (Edge AI): Looking toward 2026 the chipset market anticipates a shift toward Edge AI. Predictions indicate a broad wave of IoT devices embedded with edge AI acceleration will emerge and move beyond high-end gateways to mass-market sensors and connectivity modules.

Definitions

Connectivity chipset: A baseband processor embedded in a smart device (either directly or via a module) that enables and manages the connectivity of the device. There are two types:

    1. Cellular chipsets based on the 3GPP architecture, such as 4G, 5G, LTE-M, and NB-IoT
    2. Non-cellular chipsets, such as Wi-Fi, Bluetooth, Sigfox, LoRa, and satellite

IoT connectivity module: Embedded hardware that includes connectivity chipsets and other components, such as CPU/MCU, SIM slot/eSIM, GNSS (optional), and more
Cellular IoT module: An IoT connectivity module embedded with a cellular chipset
LPWA dual mode: A cellular IoT module embedded with a cellular chipset that supports both LTE-M and NB-IoT

Authors

Satyajit Sinha

Included data

  • 40 cellular IoT module brands
  • 13 cellular IoT chipset companies
  • 10 regions
  • 10 technology splits
  • 16 industry verticals
  • 150 unique model-level chipsets
  • 737 unique model-level modules

โ†’Full product details

Table of contents

Cellular IoT Module and Chipset Market Tracker and Forecast 2018-2029 – Q3/2025 Update (EXCEL)

  • Intro
  • Module & Chipset Pivot
  • Module & Chipset Model Level
  • Industry & Forecast Pivot
  • Industry Vertical & Forecast

Companies mentioned

A selection of companies mentioned in the report.

AM Telecom

ASR

Cavli Wireless

Ccfrom

Cheerzing

China Mobile

Continental Automotive

Eigencomm

Fibocom

GCT

Gosuncn

H3C

Hisilicon

Huawei

Intel

Kontron

Kyocera

LG Innotek

Lierda

Longsung

Marvell

Mediatek

Meig

MobileTek

Murata

Neoway

Nordic Semiconductors

Pycom

Qualcomm

Quectel

Renesas

Rinlink

Rolling Wireless

Ruijie

SG Wireless

SIMCom

STMicroelectronics

Sequans

Sercomm

Sierra Wireless

Sony Altair

Taiyo Yuden

Telit Cinterion

Titan

Trasna

UNISOC

USR(Wenheg)

Ucloudy

Wistron Neweb

Wurth Electronics

Wutong

XinYi

Yuge Technology

u-Blox

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