Global IoT eSIM Modules and iSIM Chipsets Market Tracker
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Product Details
Starting US$3,000
36 cellular IoT module brands, nested, with 13 cellular IoT chipset companies
Shipments 1Q 2018–1Q 2023 (actuals)
4 UICC technologies: eSIM, iSIM, uSIM, physical SIM
Connectivity technologies: 2G, 3G, LTE-Cat 1,LTE Cat 1 bis, 4G, LTE-M, NB-IoT, LPWA dual mode, and 5G. Including fallback and categories for each technology
10 regions: China, North America, Western Europe, Eastern Europe, the Middle East and Africa, Latin America, Japan, India, Korea, Asia, and Other
737 unique module models and 150 unique chipset models
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About the product
The Global IoT eSIM Modules and iSIM Chipsets Market Tracker is a structured market sizing database of worldwide IoT eSIM modules and iSIM chipsets. This product gets updated quarterly with the most recent data.
Definitions
Cellular IoT module: A cellular IoT module is a hardware component that enables IoT devices to connect to the internet using cellular networks. It comprises a cellular modem, a microcontroller unit (MCU), and embedded software that facilitate seamless communication between devices and the Internet. These modules utilize various generations of cellular technology, including 2G, 3G, 4G, or 5G, and Low Power Wide Area Network (LPWAN) technologies such as Narrowband IoT (NB-IoT) and LTE-M.
Cellular IoT chipset: A cellular IoT chipset refers to a baseband processor embedded in a smart device (either directly or via a module) that enables and manages the device’s connectivity. It is designed specifically to allow IoT devices to connect to cellular networks.It is based on the 3GPP architecture, such as 4G, 5G, LTE-M, and NB-IoT
eSIM: An eSIM is an embedded SIM card. It’s a replacement for—or alternative to—the physical SIM card that connects modem to a mobile network, and the eSIM is a lot smaller than a physical SIM card.
iSIM: An iSIM is an Integrated SIM. It is much smaller and offers more security than physical SIM cards or embedded SIMs. The iSIM enables devices to connect to a cellular network without needing a physical SIM card or soldered eSIM in a printed circuit board (PCB). Instead of using a separate physical SIM card, the iSIM technology embeds the SIM features directly into the cellular IoT chipset, allowing it to connect to the cellular network
SoftSIM/uSIM: A softSIM or uSIM is a software embedded SIM that can installed in the memory of device. It is similar to an eSIM but without hardware secure element.
Physical SIM: A physical SIM is a chip that is physically installed or removed inside a device
Table of contents
Global IoT eSIM Modules and iSIM Chipsets Market Tracker (EXCEL)
- Intro
- Module & Chipset Pivot
- Module & Chipset Model Level
Included data
Slice and dice the data according to your requirements.
36 cellular IoT module brands, nested, with 13 cellular IoT chipset companies
Shipments 1Q 2018–1Q 2023 (actuals)
4 UICC technologies: eSIM, iSIM, uSIM, physical SIM
Connectivity technologies: 2G, 3G, LTE-Cat 1,LTE Cat 1 bis, 4G, LTE-M, NB-IoT, LPWA dual mode, and 5G. Including fallback and categories for each technology
10 regions: China, North America, Western Europe, Eastern Europe, the Middle East and Africa, Latin America, Japan, India, Korea, Asia, and Other
737 unique module models and 150 unique chipset models
→Contact sales for a demo or a quote customized to your requirements
Related reading
The research blog article “Entering the new age of cellular IoT: eSIM/iSIM market to surpass 500 million units in 2023” is derived from this tracker.
Companies mentioned
A selection of companies mentioned in the report.
AM Telecom
ASR
Cavli Wireless
Ccfrom
Cheerzing
China Mobile
Continental Automotive
Eigencomm
Fibocom
GCT
Gosuncn
H3C
Hisilicon
Huawei
Intel
Kyocera
LG Innotek
Lierda
Longsung
Marvell
Mediatek
Meig
MobileTek
Murata
Neoway
Pycom
Qualcomm
Quectel
Rinlink
Rolling Wireless
Ruijie
SIMCom
Sequans
Sercomm
Sierra Wireless
Sony Altair
Taiyo
Yuden
Telit Cinterion
Titan
UNISOC
USR(Wenheg)
Ucloudy
Wutong
XinYi
Yuge Technology
u-blox
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