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IoT eSIM Modules and iSIM Chipsets Market Tracker (2024 Update)

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A structured market tracker that includes quarterly data on worldwide IoT eSIM modules and iSIM chipsets from 2018 to Q1 2024, including a forecast from Q2 2024 to 2028.
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Document type: XLSX, WEBAPP
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Published: September 2024
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Main author: Satyajit Sinha
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  • 38 cellular IoT module brands, nested, with 13 cellular IoT chipset companies
  • Shipments 1Q 2018–1Q 2024 (actuals)
  • 3 UICC technologies: eSIM, iSIM, uSIM/SIM, SoftSIM
  • Connectivity technologies: 2G, 3G, LTE-Cat 1,LTE Cat 1 bis, 4G, LTE-M, NB-IoT, LPWA dual mode, and 5G.
  • 10 regions: China, North America, Western Europe, Eastern Europe, the Middle East and Africa, Latin America, Japan, India, Korea, Asia, and Other
  • 737 unique module models and 150 unique chipset models

Full product details

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About the product

The Global IoT eSIM Modules and iSIM Chipsets Market Tracker is a structured market sizing database of worldwide IoT eSIM modules and iSIM chipsets. This product gets updated anually with the most recent data.

In Q2 2024, the cellular IoT module embedded with eSIM/iSIM Shipment grew 12 % . The penetration Cellular IoT modules embedded with eSIM and iSIM reached 18 % of the 3.6 billion active global cellular IoT connections. This data indicates the growing demand for flexible, fast, and efficient connectivity solutions in the new age of cellular IoT.  This database provides a quarterly look at the shipments of 35 companies providing cellular IoT modules embedded with eSIM/iSIM for IoT deployments. The database provides insight into the shipment of modules capable of eSIM and the chipset of iSIM. The database does not include the activation data of the eSIMs and iSIMs.

eSIM-based IoT security

Definitions

Cellular IoT module: A cellular IoT module is a hardware component that enables IoT devices to connect to the internet using cellular networks. It comprises a cellular modem, a microcontroller unit (MCU), and embedded software that facilitate seamless communication between devices and the Internet. These modules utilize various generations of cellular technology, including 2G, 3G, 4G, or 5G, and Low Power Wide Area Network (LPWAN) technologies such as Narrowband IoT (NB-IoT) and LTE-M.
Cellular IoT chipset: A cellular IoT chipset refers to a baseband processor embedded in a smart device (either directly or via a module) that enables and manages the device’s connectivity. It is designed specifically to allow IoT devices to connect to cellular networks.It is based on the 3GPP architecture, such as 4G, 5G, LTE-M, and NB-IoT
eSIM: An eSIM is an embedded SIM card. It’s a replacement for—or alternative to—the physical SIM card that connects modem to a mobile network, and the eSIM is a lot smaller than a physical SIM card.
iSIM: An iSIM is an Integrated SIM. It is much smaller and offers more security than physical SIM cards or embedded SIMs. The iSIM enables devices to connect to a cellular network without needing a physical SIM card or soldered eSIM in a printed circuit board (PCB). Instead of using a separate physical SIM card, the iSIM technology embeds the SIM features directly into the cellular IoT chipset, allowing it to connect to the cellular network
SoftSIM: A softSIM is a virtual SIM card installed in a device’s memory, functioning similarly to an eSIM but without the need for a physical secure element. It allows for device connectivity to cellular networks entirely through software.
Physical SIM/uSIM: A physical SIM, also known as a uSIM, is a removable chip that must be physically installed in a device to connect it to a cellular network.

Table of contents

Global IoT eSIM Modules and iSIM Chipsets Market Tracker (2024 Update) (EXCEL)

  • Intro
  • Module & Chipset Pivot
  • Module & Chipset Model Level
  • Shipment by SIM Type

Authors

Satyajit Sinha, Taha Bin Masood

Included data

Slice and dice the data according to your requirements.

  • 38 cellular IoT module brands, nested, with 13 cellular IoT chipset companies
  • Shipments 1Q 2018–1Q 2024 (actuals)
  • 3 UICC technologies: eSIM, iSIM, uSIM/SIM, SoftSIM
  • Connectivity technologies: 2G, 3G, LTE-Cat 1,LTE Cat 1 bis, 4G, LTE-M, NB-IoT, LPWA dual mode, and 5G.
  • 10 regions: China, North America, Western Europe, Eastern Europe, the Middle East and Africa, Latin America, Japan, India, Korea, Asia, and Other
  • 737 unique module models and 150 unique chipset models

Full product details

Contact sales for a demo or a quote customized to your requirements

Companies mentioned

A selection of companies mentioned in the report.

AM Telecom

ASR

Cavli Wireless

Ccfrom

Cheerzing

China Mobile

Continental Automotive

Eigencomm

Fibocom

GCT

Gosuncn

H3C

Hisilicon

Huawei

Intel

Kyocera

LG Innotek

Lierda

Longsung

Marvell

Mediatek

Meig

MobileTek

Murata

Neoway

Pycom

Qualcomm

Quectel

Rinlink

Rolling Wireless

Ruijie

SIMCom

Sequans

Sercomm

Sierra Wireless

Sony Altair

Taiyo

Yuden

Telit Cinterion

Titan

UNISOC

USR(Wenheg)

Ucloudy

Wutong

XinYi

Yuge Technology

u-blox

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