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Cellular IoT Module and Chipset Market Tracker & Forecast (Q4/2024 Update)

Cellular IoT Module and Chipset Market Tracker Forecast Q4 2024 Update - Product icon
An interactive dashboard and structured market tracker that includes quarterly data on worldwide cellular IoT modules and chipsets from 2018 to Q3 2024, including a quarterly and annual forecast from Q4 2024 to 2028.
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Document type: XLSX, WEBAPP
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Published: December 2024
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Main author: Taha Bin Masood
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  • 40 cellular IoT module brands
  • 13 cellular IoT chipset companies
  • 10 regions
  • 10 technology splits
  • 16 industry verticals
  • 150 unique model-level chipsets
  • 737 unique model-level modules

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About the product

The Global Cellular IoT Module and Chipset Market Tracker & Forecast (Update Q4/2024) represents the updated view of the cellular IoT module and chipset market for the 2018–2024 period, including a forecast for the 2025–2028 period.

This comprehensive forecast by IoT Analytics incorporates the latest information available through November 29, 2024. The analysis considers both macro and micro trends that impact the market, including global economic conditions, recovery scenarios for the general chip shortage, and the emerging challenge of AI chip scarcity. Additionally, IoT Analytics factors in the technological advancements of LTE-Cat 1, Cat 1 bis, 5G, and 5G RedCap (included in the tracker as a distinct factor).

To ensure the accuracy of this forecast, IoT Analytics conducted in-depth research through over 70 interviews with key industry players – module, chipset, and mobile network operators – at MWC, Embedded World, Hannover Messe 2024, and other. It’s important to note that this report focuses exclusively on cellular IoT chipsets embedded within IoT modules, excluding embedded standalone cellular IoT chipsets in devices.

Definitions

Connectivity chipset: A baseband processor embedded in a smart device (either directly or via a module) that enables and manages the connectivity of the device. There are two types:

    1. Cellular chipsets based on the 3GPP architecture, such as 4G, 5G, LTE-M, and NB-IoT
    2. Non-cellular chipsets, such as Wi-Fi, Bluetooth, Sigfox, LoRa, and satellite

IoT connectivity module: Embedded hardware that includes connectivity chipsets and other components, such as CPU/MCU, SIM slot/eSIM, GNSS (optional), and more
Cellular IoT module: An IoT connectivity module embedded with a cellular chipset
LPWA dual mode: A cellular IoT module embedded with a cellular chipset that supports both LTE-M and NB-IoT

Table of contents

Global Cellular IoT Module & Chipset Tracker Forecast 2018-2028 – Q4/2024 Update (EXCEL)

  • Intro
  • Module & Chipset Pivot
  • Module & Chipset Model Level
  • Industry & Forecast Pivot
  • Industry Vertical & Forecast

Authors

Satyajit Sinha, Taha Bin Masood

Included data

  • 40 cellular IoT module brands
  • 13 cellular IoT chipset companies
  • 10 regions
  • 10 technology splits
  • 16 industry verticals
  • 150 unique model-level chipsets
  • 737 unique model-level modules

Full product details

Related reading

Companies mentioned

A selection of companies mentioned in the report.

AM Telecom

ASR

Cavli Wireless

Ccfrom

Cheerzing

China Mobile

Continental Automotive

Eigencomm

Fibocom

GCT

Gosuncn

H3C

Hisilicon

Huawei

Intel

Kyocera

LG Innotek

Lierda

Longsung

Marvell

Mediatek

Meig

MobileTek

Murata

Neoway

Nordic Semiconductors

Pycom

Qualcomm

Quectel

Renesas

Rinlink

Rolling Wireless

Ruijie

Sequans

Sercomm

Sierra Wireless

SIMCom

Sony Altair

STMicroelectronics

Taiyo Yuden

Telit Cinterion

Titan

u-Blox

Ucloudy

UNISOC

USR(Wenheg)

Wistron Neweb

Wurth Electronics

Wutong

XinYi

Yuge Technology

Other

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